AMD Ryzen 7000 CPU Delidding Reveals Gold Plated IHS & Zen 4 CCD with High Quality TIM
The discontinued CPU is part of the Ryzen 9 family as it has two dies and we know that the dual CCD configuration only applies to the Ryzen 9 7950X and Ryzen 9 7900X. The chip has a total of three dies, two of which are the aforementioned AMD Zen 4 CCDs manufactured on the 5nm process node and then we have the larger die around the center which is the IOD and which is based on a 6nm process node. The AMD Ryzen 7000 CCD has a die size of 70mm2 compared to 83mm2 for the Zen 3 and has a total of 6.57 billion transistors, a 58% increase over the Zen 3 CCD with 4.15 billion transistors. Scattered around the package are quite a few SMDs (capacitors/resistors) that usually sit under the substrate of the package when considering Intel CPUs. Instead, AMD has them on the top layer, and as such, they had to design a new kind of IHS internally referred to as an octopus. We’ve already seen the IHS removed before, but now we’re seeing a final production chip without a cap to cover those golden Zen 4 nuggets! With that, the IHS is an interesting feature of the AMD Ryzen 7000 desktop processors. One image shows the 8-arm arrangement that Robert Hallock “Director of Technical Marketing at AMD” refers to as an “Octopus”. Each bracket has a small TIM fitting underneath, which is used to solder the IHS to the interferometer. Now removing the chip will be very difficult as each arm is right next to the huge capacitor bank. Each bracket is also slightly raised to make room for the SMDs, and users don’t have to worry about heat getting trapped underneath. AMD Ryzen 7000 Desktop CPU Removed (Image Credits: GamersNexus): Der8auer also gave a statement to Gamers Nexus about the upcoming removal kit for AMD Ryzen 7000 desktop processors, which is in the works, and also seems to explain why the new CPUs have gold-plated CCDs: When it comes to gold plating, there is the aspect that you can stick indium to gold without the need for flux. This makes the process easier and you don’t need harsh chemicals on your CPU. Without the gold plating, in theory soldering the silicon to the copper would also work, but it would be more difficult and you would need the flux to break the oxide layers. Der8auer at GamersNexus The most interesting area of the AMD Ryzen 7000 Desktop CPU IHS, other than the brackets, is the gold-plated IHS used to increase heat dissipation from the CPU/IO dies and directly to the IHS. The two 5nm Zen 4 CCDs and the single 6nm IO die have liquid-metal or thermal interface material for better heat conduction, and the aforementioned gold coating helps a lot with heat dissipation. What remains to be seen is whether or not the capacitors will feature a silicon coating, but from the earlier shot of the package, it looks like they do. It is also said that the smaller surface area of the IHS means it will be better compatible with existing coolers with round and square shaped cold plates. Square shaped cold plates will be the preferred choice, but round ones will also work just fine. Noctua has also highlighted the TIM application method and suggests that users use the dot pattern in the middle of the IHS for AMD AM5 processors. AMD Ryzen 7000 Desktop CPU Render (With/Without IHS): Another thing to note is that each Zen 4 CCD sits very close to the edge of the IHS, which wasn’t necessarily the case with previous Zen processors. So, not only will removal be very difficult, but the center is mainly the IO die, which means that the cooling equipment must be ready for such chips. AMD Ryzen 7000 desktop processors launch in fall 2022 on the AM5 platform. This is a chip that can go up to 5.85GHz with a package power of up to 230W, so every little bit of cooling will be essential for overclockers and enthusiasts.
AMD Mainstream Desktop Processor Generations Comparison:
AMD CPU FamilyCodenameProcessor ProcessProcessors Cores/Threads (Max)TDPs (Max)PlatformPlatform ChipsetMemory SupportPCIe SupportLaunch Ryzen 1000Summit Ridge14nm (Zen 1)8/1695WAM4300-SeriesDDR4-2677Gen 3.02017 Ryzen 2000Pinnacle Ridge12nm (Zen +)8/16105WAM4400-SeriesDDR4-2933Gen 3.020018 Ryzen Matisse 7nm (Zen 2)16/32105WAM4500-SeriesDDR4-3200Gen 4.02019 Ryzen 5000Vermeer7nm (Zen 3)16/32105WAM4500-SeriesDDR4-3200Gen 4.02020 Ryzen 5000 3DWarhol?7nm (Zen 3D)8/16105WAM4500-SeriesDDR4-3200Gen 4.02022 Ryzen 7000Raphael5nm (Zen 4)16 /32170WAM5600-SERIESDDR5-5200GEN 5.02022 RYZEN 7000 3DRAPHAEL5NM (ZEN 4) 16/32; 105-170WAM5600-SERIESDDR5-5200/5600; GEN 5.02023 ryzen 8000Granite Ridge3nm (ZEN 5); ?
title: “Gold Plated Zen 4 Ccd And Octopus Style Ihs For Wider Cooling Compatibility Klmat” ShowToc: true date: “2022-11-08” author: “Michael Card”
AMD Ryzen 7000 CPU Delidding Reveals Gold Plated IHS & Zen 4 CCD with High Quality TIM
The discontinued CPU is part of the Ryzen 9 family as it has two dies and we know that the dual CCD configuration only applies to the Ryzen 9 7950X and Ryzen 9 7900X. The chip has a total of three dies, two of which are the aforementioned AMD Zen 4 CCDs manufactured on the 5nm process node and then we have the larger die around the center which is the IOD and which is based on a 6nm process node. The AMD Ryzen 7000 CCD has a die size of 70mm2 compared to 83mm2 for the Zen 3 and has a total of 6.57 billion transistors, a 58% increase over the Zen 3 CCD with 4.15 billion transistors. Scattered around the package are quite a few SMDs (capacitors/resistors) that usually sit under the substrate of the package when considering Intel CPUs. Instead, AMD has them on the top layer, and as such, they had to design a new kind of IHS internally referred to as an octopus. We’ve already seen the IHS removed before, but now we’re seeing a final production chip without a cap to cover those golden Zen 4 nuggets! With that, the IHS is an interesting feature of the AMD Ryzen 7000 desktop processors. One image shows the 8-arm arrangement that Robert Hallock “Director of Technical Marketing at AMD” refers to as an “Octopus”. Each bracket has a small TIM fitting underneath, which is used to solder the IHS to the interferometer. Now removing the chip will be very difficult as each arm is right next to the huge capacitor bank. Each bracket is also slightly raised to make room for the SMDs, and users don’t have to worry about heat getting trapped underneath. AMD Ryzen 7000 Desktop CPU Removed (Image Credits: GamersNexus): Der8auer also gave a statement to Gamers Nexus about the upcoming removal kit for AMD Ryzen 7000 desktop processors, which is in the works, and also seems to explain why the new CPUs have gold-plated CCDs: When it comes to gold plating, there is the aspect that you can stick indium to gold without the need for flux. This makes the process easier and you don’t need harsh chemicals on your CPU. Without the gold plating, in theory soldering the silicon to the copper would also work, but it would be more difficult and you would need the flux to break the oxide layers. Der8auer at GamersNexus The most interesting area of the AMD Ryzen 7000 Desktop CPU IHS, other than the brackets, is the gold-plated IHS used to increase heat dissipation from the CPU/IO dies and directly to the IHS. The two 5nm Zen 4 CCDs and the single 6nm IO die have liquid-metal or thermal interface material for better heat conduction, and the aforementioned gold coating helps a lot with heat dissipation. What remains to be seen is whether or not the capacitors will feature a silicon coating, but from the earlier shot of the package, it looks like they do. It is also said that the smaller surface area of the IHS means it will be better compatible with existing coolers with round and square shaped cold plates. Square shaped cold plates will be the preferred choice, but round ones will also work just fine. Noctua has also highlighted the TIM application method and suggests that users use the dot pattern in the middle of the IHS for AMD AM5 processors. AMD Ryzen 7000 Desktop CPU Render (With/Without IHS): Another thing to note is that each Zen 4 CCD sits very close to the edge of the IHS, which wasn’t necessarily the case with previous Zen processors. So, not only will removal be very difficult, but the center is mainly the IO die, which means that the cooling equipment must be ready for such chips. AMD Ryzen 7000 desktop processors launch in fall 2022 on the AM5 platform. This is a chip that can go up to 5.85GHz with a package power of up to 230W, so every little bit of cooling will be essential for overclockers and enthusiasts.
AMD Mainstream Desktop Processor Generations Comparison:
AMD CPU FamilyCodenameProcessor ProcessProcessors Cores/Threads (Max)TDPs (Max)PlatformPlatform ChipsetMemory SupportPCIe SupportLaunch Ryzen 1000Summit Ridge14nm (Zen 1)8/1695WAM4300-SeriesDDR4-2677Gen 3.02017 Ryzen 2000Pinnacle Ridge12nm (Zen +)8/16105WAM4400-SeriesDDR4-2933Gen 3.020018 Ryzen Matisse 7nm (Zen 2)16/32105WAM4500-SeriesDDR4-3200Gen 4.02019 Ryzen 5000Vermeer7nm (Zen 3)16/32105WAM4500-SeriesDDR4-3200Gen 4.02020 Ryzen 5000 3DWarhol?7nm (Zen 3D)8/16105WAM4500-SeriesDDR4-3200Gen 4.02022 Ryzen 7000Raphael5nm (Zen 4)16 /32170WAM5600-SERIESDDR5-5200GEN 5.02022 RYZEN 7000 3DRAPHAEL5NM (ZEN 4) 16/32; 105-170WAM5600-SERIESDDR5-5200/5600; GEN 5.02023 ryzen 8000Granite Ridge3nm (ZEN 5); ?
title: “Gold Plated Zen 4 Ccd And Octopus Style Ihs For Wider Cooling Compatibility Klmat” ShowToc: true date: “2022-11-23” author: “William Bekis”
AMD Ryzen 7000 CPU Delidding Reveals Gold Plated IHS & Zen 4 CCD with High Quality TIM
The discontinued CPU is part of the Ryzen 9 family as it has two dies and we know that the dual CCD configuration only applies to the Ryzen 9 7950X and Ryzen 9 7900X. The chip has a total of three dies, two of which are the aforementioned AMD Zen 4 CCDs manufactured on the 5nm process node and then we have the larger die around the center which is the IOD and which is based on a 6nm process node. The AMD Ryzen 7000 CCD has a die size of 70mm2 compared to 83mm2 for the Zen 3 and has a total of 6.57 billion transistors, a 58% increase over the Zen 3 CCD with 4.15 billion transistors. Scattered around the package are quite a few SMDs (capacitors/resistors) that usually sit under the substrate of the package when considering Intel CPUs. Instead, AMD has them on the top layer, and as such, they had to design a new kind of IHS internally referred to as an octopus. We’ve already seen the IHS removed before, but now we’re seeing a final production chip without a cap to cover those golden Zen 4 nuggets! With that, the IHS is an interesting feature of the AMD Ryzen 7000 desktop processors. One image shows the 8-arm arrangement that Robert Hallock “Director of Technical Marketing at AMD” refers to as an “Octopus”. Each bracket has a small TIM fitting underneath, which is used to solder the IHS to the interferometer. Now removing the chip will be very difficult as each arm is right next to the huge capacitor bank. Each bracket is also slightly raised to make room for the SMDs, and users don’t have to worry about heat getting trapped underneath. AMD Ryzen 7000 Desktop CPU Removed (Image Credits: GamersNexus): Der8auer also gave a statement to Gamers Nexus about the upcoming removal kit for AMD Ryzen 7000 desktop processors, which is in the works, and also seems to explain why the new CPUs have gold-plated CCDs: When it comes to gold plating, there is the aspect that you can stick indium to gold without the need for flux. This makes the process easier and you don’t need harsh chemicals on your CPU. Without the gold plating, in theory soldering the silicon to the copper would also work, but it would be more difficult and you would need the flux to break the oxide layers. Der8auer at GamersNexus The most interesting area of the AMD Ryzen 7000 Desktop CPU IHS, other than the brackets, is the gold-plated IHS used to increase heat dissipation from the CPU/IO dies and directly to the IHS. The two 5nm Zen 4 CCDs and the single 6nm IO die have liquid-metal or thermal interface material for better heat conduction, and the aforementioned gold coating helps a lot with heat dissipation. What remains to be seen is whether or not the capacitors will feature a silicon coating, but from the earlier shot of the package, it looks like they do. It is also said that the smaller surface area of the IHS means it will be better compatible with existing coolers with round and square shaped cold plates. Square shaped cold plates will be the preferred choice, but round ones will also work just fine. Noctua has also highlighted the TIM application method and suggests that users use the dot pattern in the middle of the IHS for AMD AM5 processors. AMD Ryzen 7000 Desktop CPU Render (With/Without IHS): Another thing to note is that each Zen 4 CCD sits very close to the edge of the IHS, which wasn’t necessarily the case with previous Zen processors. So, not only will removal be very difficult, but the center is mainly the IO die, which means that the cooling equipment must be ready for such chips. AMD Ryzen 7000 desktop processors launch in fall 2022 on the AM5 platform. This is a chip that can go up to 5.85GHz with a package power of up to 230W, so every little bit of cooling will be essential for overclockers and enthusiasts.
AMD Mainstream Desktop Processor Generations Comparison:
AMD CPU FamilyCodenameProcessor ProcessProcessors Cores/Threads (Max)TDPs (Max)PlatformPlatform ChipsetMemory SupportPCIe SupportLaunch Ryzen 1000Summit Ridge14nm (Zen 1)8/1695WAM4300-SeriesDDR4-2677Gen 3.02017 Ryzen 2000Pinnacle Ridge12nm (Zen +)8/16105WAM4400-SeriesDDR4-2933Gen 3.020018 Ryzen Matisse 7nm (Zen 2)16/32105WAM4500-SeriesDDR4-3200Gen 4.02019 Ryzen 5000Vermeer7nm (Zen 3)16/32105WAM4500-SeriesDDR4-3200Gen 4.02020 Ryzen 5000 3DWarhol?7nm (Zen 3D)8/16105WAM4500-SeriesDDR4-3200Gen 4.02022 Ryzen 7000Raphael5nm (Zen 4)16 /32170WAM5600-SERIESDDR5-5200GEN 5.02022 RYZEN 7000 3DRAPHAEL5NM (ZEN 4) 16/32; 105-170WAM5600-SERIESDDR5-5200/5600; GEN 5.02023 ryzen 8000Granite Ridge3nm (ZEN 5); ?
title: “Gold Plated Zen 4 Ccd And Octopus Style Ihs For Wider Cooling Compatibility Klmat” ShowToc: true date: “2022-12-13” author: “Jermaine Throckmorton”
AMD Ryzen 7000 CPU Delidding Reveals Gold Plated IHS & Zen 4 CCD with High Quality TIM
The discontinued CPU is part of the Ryzen 9 family as it has two dies and we know that the dual CCD configuration only applies to the Ryzen 9 7950X and Ryzen 9 7900X. The chip has a total of three dies, two of which are the aforementioned AMD Zen 4 CCDs manufactured on the 5nm process node and then we have the larger die around the center which is the IOD and which is based on a 6nm process node. The AMD Ryzen 7000 CCD has a die size of 70mm2 compared to 83mm2 for the Zen 3 and has a total of 6.57 billion transistors, a 58% increase over the Zen 3 CCD with 4.15 billion transistors. Scattered around the package are quite a few SMDs (capacitors/resistors) that usually sit under the substrate of the package when considering Intel CPUs. Instead, AMD has them on the top layer, and as such, they had to design a new kind of IHS internally referred to as an octopus. We’ve already seen the IHS removed before, but now we’re seeing a final production chip without a cap to cover those golden Zen 4 nuggets! With that, the IHS is an interesting feature of the AMD Ryzen 7000 desktop processors. One image shows the 8-arm arrangement that Robert Hallock “Director of Technical Marketing at AMD” refers to as an “Octopus”. Each bracket has a small TIM fitting underneath, which is used to solder the IHS to the interferometer. Now removing the chip will be very difficult as each arm is right next to the huge capacitor bank. Each bracket is also slightly raised to make room for the SMDs, and users don’t have to worry about heat getting trapped underneath. AMD Ryzen 7000 Desktop CPU Removed (Image Credits: GamersNexus): Der8auer also gave a statement to Gamers Nexus about the upcoming removal kit for AMD Ryzen 7000 desktop processors, which is in the works, and also seems to explain why the new CPUs have gold-plated CCDs: When it comes to gold plating, there is the aspect that you can stick indium to gold without the need for flux. This makes the process easier and you don’t need harsh chemicals on your CPU. Without the gold plating, in theory soldering the silicon to the copper would also work, but it would be more difficult and you would need the flux to break the oxide layers. Der8auer at GamersNexus The most interesting area of the AMD Ryzen 7000 Desktop CPU IHS, other than the brackets, is the gold-plated IHS used to increase heat dissipation from the CPU/IO dies and directly to the IHS. The two 5nm Zen 4 CCDs and the single 6nm IO die have liquid-metal or thermal interface material for better heat conduction, and the aforementioned gold coating helps a lot with heat dissipation. What remains to be seen is whether or not the capacitors will feature a silicon coating, but from the earlier shot of the package, it looks like they do. It is also said that the smaller surface area of the IHS means it will be better compatible with existing coolers with round and square shaped cold plates. Square shaped cold plates will be the preferred choice, but round ones will also work just fine. Noctua has also highlighted the TIM application method and suggests that users use the dot pattern in the middle of the IHS for AMD AM5 processors. AMD Ryzen 7000 Desktop CPU Render (With/Without IHS): Another thing to note is that each Zen 4 CCD sits very close to the edge of the IHS, which wasn’t necessarily the case with previous Zen processors. So, not only will removal be very difficult, but the center is mainly the IO die, which means that the cooling equipment must be ready for such chips. AMD Ryzen 7000 desktop processors launch in fall 2022 on the AM5 platform. This is a chip that can go up to 5.85GHz with a package power of up to 230W, so every little bit of cooling will be essential for overclockers and enthusiasts.
AMD Mainstream Desktop Processor Generations Comparison:
AMD CPU FamilyCodenameProcessor ProcessProcessors Cores/Threads (Max)TDPs (Max)PlatformPlatform ChipsetMemory SupportPCIe SupportLaunch Ryzen 1000Summit Ridge14nm (Zen 1)8/1695WAM4300-SeriesDDR4-2677Gen 3.02017 Ryzen 2000Pinnacle Ridge12nm (Zen +)8/16105WAM4400-SeriesDDR4-2933Gen 3.020018 Ryzen Matisse 7nm (Zen 2)16/32105WAM4500-SeriesDDR4-3200Gen 4.02019 Ryzen 5000Vermeer7nm (Zen 3)16/32105WAM4500-SeriesDDR4-3200Gen 4.02020 Ryzen 5000 3DWarhol?7nm (Zen 3D)8/16105WAM4500-SeriesDDR4-3200Gen 4.02022 Ryzen 7000Raphael5nm (Zen 4)16 /32170WAM5600-SERIESDDR5-5200GEN 5.02022 RYZEN 7000 3DRAPHAEL5NM (ZEN 4) 16/32; 105-170WAM5600-SERIESDDR5-5200/5600; GEN 5.02023 ryzen 8000Granite Ridge3nm (ZEN 5); ?
